Method for delivering circuit board plating copper

 

Copper plating is unpleasant cost of copper particles from it? Can be added to the shower 0.03 ~ 0.05ml/L of 30% hydrogen peroxide test after plating,Guest Posting in the event that the cost of copper particles is caused, throughout some stretch of time will copper, demonstrating a cost of copper particles is extremely simple to create. You ought to check the manner in which the development of copper powder.

Copper creation ways: First, actually look at phosphor anode: (1) Check whether the outer layer of the anode phosphor dark film, phosphor copper anode surface assuming no dark film dark film or less, demonstrating that phosphor copper anode with low phosphorus , could not handle the development of monovalent copper particles, the arrangement of copper at any point powder, copper plating caused harsh. Need to supplant phosphor copper anode. (2) Phosphor copper anode can not surpass the copper plating surface. Past the outer layer of the phosphor copper anode since there is no dark film security, when the phosphor copper anode titanium crate bit by bit decline, there is no dark film to safeguard the phosphor copper anode into copper plating arrangement, and before long produce cuprous particles to shape copper powder, bringing about unpleasant copper plating; furthermore, there is no dark film to safeguard the phosphor copper anode surface is not difficult to cuprous sulfate precious stones, rapidly falling into the copper plating answer for produce a cost of copper particles, the development of copper powder, copper plating caused harsh. Need to control how much phosphor copper anode added. (3) Plating shower on the board can not have a conductive copper bar or gem copper ribbon wire , conductivity copper bar itself is a crystallization of Cu particles into the shower, will rapidly create a cost of copper particles, the development of copper powder, causing copper covering unpleasantness.

Second, check the chloride particle content: (1) Low chloride particles, chloride particles could not be the maximum of copper particles with a blend of copper in the development of divalent copper particles in the process at any point can not be a the maximum of copper particles (chloride copper) into divalent copper particles (copper sulfate), the arrangement of bronze powder(FCu 663), plating brought about by harsh; Cl decrease is basically from the huge anode region and caused a little cathode region. That term in the enormous tank or shower plating exorbitant number of little example size and little size board. Little cathode copper (II) particles expected for less, while the anode is generally more cuprous chloride stored on the anode, or is probably going to tumble off and sedimentation made by constant filtration eliminate chlorine particles in the shower diminished. (2) High when chloride particles, the arrangement of overabundance cuprous chloride, cuprous chloride particles such abundance will create lopsided response, the development of copper powder, copper plating caused harsh. Expanded degrees of chloride particles basically from clean water, add water. (3) The midpoint of the